vbid/9783030300982

$159.00

Author(s): Author
Publisher: Springer
ISBN: 9783030300975
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Description

Residual Stress, Thermomechanics & Infrared Imaging and Inverse Problems, Volume 6 of the Proceedings of the 2019 SEM Annual Conference & Exposition on Experimental and Applied Mechanics, the sixth volume of six from the Conference, brings together contributions to this important area of research and engineering.� The collection presents early findings and case studies on a wide range of areas, including: Test Design and Inverse Method Algorithms Inverse Problems: Virtual Fields Method Residual Stresses: Measurement, Uncertainty & Validation Residual Stresses: Eigenvalues, Modeling, & Crack Growth Material Characterizations Using Thermography Fatigue, Damage & Fracture Evaluation Using Infrared Thermography �Typham this is the title: Residual Stress, Thermomechanics & Infrared Imaging and Inverse Problems, Volume 6 Proceedings of the 2019 Annual Conference on Experimental and Applied Mechanics

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